i ntegrated c ircuits d ivision ds-mx887p-r01 www.ixysic.com 1 e 3 pb features ? ? power operation (15 ? w typical at 25c) ? omnipolar (switches with n or s pole) ? 2.5v to 5.5v operation ? cmos push-pull output ? ultra low offset canceling amplifiers provide sensitive, accurate, stable switching points and immunity to mechanical stress ? solid state reliability ? operating temperature range: -40c to +85c ? rohs compliant tsot23 3-lead package applications ? handheld portable devices ? white goods ? automotive - body systems ? security systems ? high reliability reed switch replacement description the mx887p integrated hall-effect switch targets the requirements of low-power portable devices with battery operating voltages from 2.5v to 5.5v. on-chip power management circuitry reduces the effective average current to just 5 ? a at v supply = 3v dc . the switch output will transition to the ground potential when either a north or south magnetic pole is applied. the removal of a magnetic field will transition the switch to the v supply potential. emulating the behavior of a traditional reed switch, together with the advantages of high integration and solid state reliability, makes the mx887p an ideal replacement in low-power portable device applications. ordering information figure 1. functional block diagram part description MX887PHTTR tsot23 3l tape & reel (3000/reel) hall sensor offset cancellation output latch v supply output switch power management logic 1 2 3 mx887p ? power hall-effect switch
i ntegrated c ircuits d ivision mx887p 2 www.ixysic.com r01 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.5 esd rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 magnetic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2. circuit description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 esd sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.3 reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.4 board wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.5 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
i ntegrated c ircuits d ivision mx887p r01 www.ixysic.com 3 1 specifications 1.1 package pinout 1.2 pin description 1.3 absolute maximum ratings absolute maximum electrical ratings are at 25c. absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 electrical characteristics over operating voltage and temperature range unless otherwise specified. notes: 1. b opx = operating point (output turns on); b rpx = release point (output turns off). 2. typical data is at 25c and v supply = 3v. 12 3 pin# name description 1 v supply 2.5v to 5.5v 2out push-pull cmos output 3 ground ground parameter symbol min max units supply voltage v supply -0.5 6 v dc output voltage v out -0.5 6 v magnetic flux density b - unlimited g output current - - 5 ma junction temperature t j -1 5 0 c operating ambient temperature t a -40 85 storage temperature t stg -40 150 parameter conditions symbol minimum typical maximum units supply voltage range operating v supply 2.5 - 5.5 v dc output leakage current v out =5.5v, b rpn < b < b rps i lkg --1 ? a output on voltage i out =1ma, v dd =3.0v v out -100300mv awake time - ---9 0 ? s period - ---9 0m s duty cycle - --0 . 1-% supply current awake (enabled) i supply --2ma asleep (disabled) --8 ? a average (calculated) -515 ? a
i ntegrated c ircuits d ivision mx887p 4 www.ixysic.com r01 1.5 esd rating 1.6 magnetic characteristics over operating voltage and temperature range unless otherwise specified. notes: 1. as used here, negative flux densities are defined as less than zero (algebraic convention); -50g<+10g. 2. b opx = operating point (output turns on); b rpx = release point (output turns off). 3. typical data is at 25c and v supply = 3v. 2 circuit description the mx887p ? power hall-effect switch consists of a hall element, small-signal amplifier, latch, and cmos push-pull output. offset canc ellation circuitry rejects errors in signal stages and the influence of mechanical stress on the hall element. this technique, together with a precision threshold generator and comparator, produces highly accurate magnetic switch points. the hall element is activated for a small fraction of an operating cycle, then latched in that sample state for the remainder of the period. by using this technique, very low power consumption is achieved. esd rating (human body model) 2000v parameter conditions symbol minimum typical maximum units operating points due to north pole applied north pole to branded side b opn -60 - - g due to south pole applied south pole to branded side b ops --60 release points due to north pole applied north pole to branded side b rpn ---6 g due to south pole applied south pole to branded side b rps 6- - hysteresis | b opx - b rpx | b hys -5-g
i ntegrated c ircuits d ivision mx887p r01 www.ixysic.com 5 3 manufacturing information 3.1 moisture sensitivity all plastic encapsulated semiconductor packages are susc eptible to moisture ingression. ixys integrated circuits division clas sified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 3.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 3.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. 3.4 board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. chlorine-based or fluorine-based solvents or fluxes should not be used. clean ing methods that employ ultrasonic energy should not be used. device moisture sensitivity level (msl) rating mx887p msl 3 device maximum temperature x time mx887p 260c for 30 seconds e 3 pb
i ntegrated c ircuits d ivision mx887p 6 www.ixysic.com r01 3.5 mechanical dimensions 3.5.1 mx887pht tsot23 3-lead package 3.5.2 MX887PHTTR tape & reel packaging dimensions mm min / mm max (inches min / inches max) recommended pcb land pattern 2.60 / 3.00 (0.102 / 0.11 8) 0.10 / 0.25 (0.004 / 0.010) 0.37 / 0.47 (0.015 / 0.019) 2.80 / 3.00 (0.110 / 0.11 8) 0.75 / 0.90 (0.030 / 0.035) 0.95 bsc (0.037 bsc) 1.50 / 1.70 (0.059 / 0.067) 0.35 / 0.51 (0.014 / 0.020) 0.00 / 0.10 (0.000 / 0.004) 0.70 / 0.80 (0.028 / 0.031) 1.90 bsc (0.0748 bsc) 0.60 ref (0.0236 ref) gauge pla ne 0.25 bsc (0.0098 bsc) 0.10 min (0.004 min) 5o nom 7o nom 0o / 8o 1 2 3 1.05 (0.041) 2.70 (0.106) 0.95 (0.037) 0.60 (0.024) n otes: (unless otherwise specified) 1. dimension ?d? does not incl ude mold flash, protr u sions, or gate bu rrs. mold flash, protr u sions, and gate bu rrs shall not exceed 0.10mm (0.004 inches) per side. 2. dimension ?e? does not incl ude inter-lead flash or protr u sions. inter-lead flash and protr u sions shall not exceed 0.15mm (0.006 inches) per side. 3. package top may b e smaller than package b ottom. dimensions ?d? and ?e1? are determined at the o u termost extreme of the plastic body excl uding mold flash, tie bar bu rrs, gate bu rrs, and interlead flash, bu t inclu ding any mismatch betw een top and bottom of the plastic b ody. e e1 d note: tape dimensions not sho wn comply with jedec standard eia-481-2 embossment emb ossed carrier top co v er tape thickness 0.066 max. (0.003 max.) 178 dia. (7.01 dia.) dimensions mm (inches) k 0 =1.1 0.1 (0.043 0.004) p=4.0 0.1 (0.157 0.004) a o =3.2 0.1 (0.126 0.004) b o =3.2 0.1 (0.126 0.004) w=8.0 0.2 (0.315 0.008) p=4.0 0.1 (0.157 0.004) 2.0 0.05 (0.079 0.002) 1.75 0.1 (0.069 0.004) ?1.5, +0.1, -0 (?0.059, +0.004, -0) 3.5 0.05 (0.138 0.002) ?1.1 0.1 (0.043 0.004) 0.25 0.05 (0.001 0.002) specification: ds-mx887p-r01 ?copyright 2012, ixys integrated circuits division all rights reserved. printed in usa. 12/22/2012 for additional information please visit www.ixysic.com ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit paten t licenses or indemnity are expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated c ircuits division assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, inte nded, authorized, or warranted for use as components in systems i ntended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits divisi on?s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the r ight to discontinue or make changes to its products at any time without notice.
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